Patent Assignment
Reel/Frame 023540/0381
Assignment of Assignor's Interest
Recorded: 2009-11-18
Pages: 4
Assignors
TANAKA, AKIRA
Executed: 2009-10-21
TAKIZAWA, MINORU
Executed: 2009-10-21
TANIMOTO, MITSUYOSHI
Executed: 2009-10-22
HAPPOYA, AKIHIKO
Executed: 2009-10-22
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Semiconductor Chip Mounting Body, Method of Manufacturing Semiconductor Chip Mounting Body and Electronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.