Semiconductor chip mounting body, method of manufacturing semiconductor chip mounting body and electronic device
View Patent ↗According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.
1. An electronic device comprising:
a casing; and
a semiconductor chip mounting body placed inside the casing; wherein the semiconductor chip mounting body comprises a circuit board having a circuit pattern formed on the mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip and on the sides of the semiconductor chip in order to fix the semiconductor chip on the circuit board, wherein the bonding member comprises thermosetting resin and magnetic powder dispersed in the thermosetting resin, wherein the grains of magnetic powder are non-uniformly dispersed within the resin, such that the powder has a higher concentration at the bonding portions corresponding to the corners of the semiconductor chip.
2. The electronic device of claim 1 , wherein the non-uniformly dispersed grains of magnetic powder are further dispersed within the resin such that the powder has a higher concentration on a side surface of the bonding member opposite to an electromagnetic wave source.
3. The electronic device of claim 1 , wherein the bonding member is extended to cover a surface of the semiconductor chip which is located on the opposite side from a surface of the semiconductor chip facing the circuit board and wherein the non-uniformly dispersed grains of magnetic powder are dispersed within the resin such that the powder has a higher concentration in the surface of the bonding member located on the opposite side from the surface facing the circuit board.
4. The electronic device of claim 1 , wherein the magnetic powder is ferrite powder.
5. The electronic device of claim 1 , wherein the magnetic powder has a mean particle size of 0.1 to 10 μm.