Patent Assignment
Reel/Frame 023570/0924
Assignment of Assignor's Interest
Recorded: 2009-11-25
Pages: 3
Assignors
OH, GYU-HWAN
Executed: 2009-10-28
PARK, YOUNG-LIM
Executed: 2009-10-28
PARK, SOON-OH
Executed: 2009-10-28
LEE, JIN-IL
Executed: 2009-10-28
KIM, CHANG-SU
Executed: 2009-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO REPUBLIC OF, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Phase-Change Memory Device Having Tic Layer