Patent Assignment
Reel/Frame 023589/0118
Assignment of Assignor's Interest
Recorded: 2009-12-01
Pages: 3
Assignor
JU, JAE-IL
Executed: 2000-08-21
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Covered Property
(1)
Inductor and Fabricating Method Thereof
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Change of Name
Mar 24, 2016
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 038240/0193 →
Assignment of Assignor's Interest
Mar 24, 2016
From: JU, JAE-IL
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 038088/0849 →