Patent Assignment
Reel/Frame 023612/0336
Assignment of Assignor's Interest
Recorded: 2009-12-07
Pages: 4
Assignors
KOROKU, TAISUKE
Executed: 2009-11-19
OKADA, OSAMU
Executed: 2009-11-19
KUWABARA, OSAMU
Executed: 2009-11-24
SHIOTA, JUNJI
Executed: 2009-11-19
FUJII, NOBUMITSU
Executed: 2009-11-24
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI, 1-CHOME, SHIBUYA-KU,, TOKYO, 151-8543, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device in Which Bottom Surface and Side Surface of Semiconductor Substrate Are Covered with Resin Protective Film
Application:
12/632,054 →
Publication:
US 2010/0144097
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027520/0401 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027520/Frame 0401
Jan 13, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027546/0390 →