IP Library › Assignment 027520/0401
Patent Assignment
Reel/Frame 027520/0401

Change of Ownership by Corporate Separation

Recorded: 2012-01-03 Pages: 3
Assignor
CASIO COMPUTER CO., LTD.
Executed: 2011-12-12
Assignee
TERAMIKROS, INC.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Properties (23)
Semiconductor Device Comprising Electromigration Prevention Film and Manufacturing Method Thereof
Patent: 8,749,065 →
Application: 12/009,719 →
Publication: US 2008/0191357
Semiconductor Device Having Semiconductor Structure Bodies on Upper and Lower Surfaces Thereof, and Method of Manufacturing the Same
Patent: 8,089,777 →
Application: 12/042,427 →
Publication: US 2008/0239686
Semiconductor Device with Magnetic Powder Mixed Therein and Manufacturing Method Thereof
Patent: 8,110,882 →
Application: 12/069,689 →
Publication: US 2008/0191349
Semiconductor Device Including a Base Plate with a Plurality of Openings and a Semiconductor Construct Having External Connection Electroded Bonded to Vertical Conductors in the Openings of the Base Plate
Application: 12/262,481 →
Publication: US 2009/0065926
Circuit Board, Semiconductor Device, and Manufacturing Method of Circuit Board
Application: 12/401,510 →
Publication: US 2009/0174062
Semiconductor Device Having Low Dielectric Constant Film and Manufacturing Method Thereof
Patent: 8,154,133 →
Application: 12/412,576 →
Publication: US 2009/0243097
Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof
Patent: 8,097,941 →
Application: 12/566,423 →
Publication: US 2010/0015795
Method of Manufacturing Semiconductor Device in Which Bottom Surface and Side Surface of Semiconductor Substrate Are Covered with Resin Protective Film
Application: 12/632,006 →
Publication: US 2010/0144095
Method of Manufacturing Semiconductor Device in Which Bottom Surface and Side Surface of Semiconductor Substrate Are Covered with Resin Protective Film
Application: 12/632,054 →
Publication: US 2010/0144097
Semiconductor Device Having a Plurality of Semiconductor Constructs
Patent: 8,293,574 →
Application: 12/719,411 →
Publication: US 2010/0178731
Semiconductor Device Having Sealing Film and Manufacturing Method Thereof
Patent: 8,354,349 →
Application: 12/727,406 →
Publication: US 2010/0173455
Semiconductor Device Including Semiconductor Constituent
Patent: 8,063,490 →
Application: 12/729,608 →
Publication: US 2010/0193938
Semiconductor Device Manufacturing Method
Application: 12/827,651 →
Publication: US 2011/0001247
Semiconductor Construct and Manufacturing Method Thereof as Well as Semiconductor Device and Manufacturing Method Thereof
Patent: 8,525,335 →
Application: 12/828,492 →
Publication: US 2011/0001238
Semiconductor Device and Manufacturing Method Thereof
Patent: 8,421,187 →
Application: 12/848,355 →
Publication: US 2011/0031584
Semiconductor Device and Method for Manufacturing the Same
Patent: 8,268,674 →
Application: 12/849,529 →
Publication: US 2010/0317154
Semiconductor Device Including Semiconductor Construct Installed on Base Plate, and Manufacturing Method of the Same
Application: 12/944,114 →
Publication: US 2011/0115080
Semiconductor Device Formation Substrate and Semiconductor Device Manufacturing Method
Application: 12/960,702 →
Publication: US 2011/0133185
Semiconductor Device Provided with Tin Diffusion Inhibiting Layer, and Manufacturing Method of the Same
Patent: 8,237,277 →
Application: 13/069,771 →
Publication: US 2011/0233769
Imaging Apparatus Having a Photosensor Provided on a Lower Surface of a Semiconductor Substrate and a Lens Unit Provided on an Upper Surface of the Semiconductor Substrate, and Manufacturing Method of the Same
Patent: 8,507,309 →
Application: 13/115,348 →
Publication: US 2011/0291212
Semiconductor Device and Manufacturing Method of the Same
Application: 13/152,620 →
Publication: US 2011/0304043
Semiconductor Device and Manufacturing Method of the Same
Patent: 8,564,128 →
Application: 13/225,693 →
Publication: US 2012/0074564
Semiconductor Device Provided with Rear Protective Film on Other Side of Semiconductor Substrate and Manufacturing Method of the Same
Application: 13/232,180 →
Publication: US 2012/0074565
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 22, 2008
From: KOUNO, ISHIRO; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020447/0576 →
Assignment of Assignor's Interest Feb 12, 2008
From: AOKI, YUTAKA
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020565/0395 →
Assignment of Assignor's Interest Mar 5, 2008
From: NEGISHI, YUJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020601/0668 →
Assignment of Assignor's Interest Mar 27, 2009
From: KOROKU, TAISUKE; WAKABAYASHI, TAKESHI; OKADA, OSAMU; KUWABARA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 022461/0698 →
Corrective Assignment to Correct the Execution Date of the Fourth Assignor from "03/17/2009" to --03/18/2009--. Previously Recorded on Reel 022461 Frame 0698. Assignor(S) Hereby Confirms the Execution Date of the Fourth Assignor Is 03/18/2009.. Apr 28, 2009
From: KOROKU, TAISUKE; WAKABAYASHI, TAKESHI; OKADA, OSAMU; KUWABARA, OSAMU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 022606/0419 →
Assignment of Assignor's Interest Dec 7, 2009
From: KOROKU, TAISUKE; OKADA, OSAMU; KUWABARA, OSAMU; SHIOTA, JUNJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 023612/0336 →
Assignment of Assignor's Interest Dec 7, 2009
From: KOROKU, TAISUKE; OKADA, OSAMU; KUWABARA, OSAMU; SHIOTA, JUNJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 023611/0689 →
Assignment of Assignor's Interest Jun 30, 2010
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 024618/0872 →
Assignment of Assignor's Interest Jul 1, 2010
From: WAKISAKA, SHINJI; WAKABAYASHI, TAKESHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 024623/0452 →
Assignment of Assignor's Interest Aug 2, 2010
From: KOTANI, SYOUICHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 024773/0143 →
Corrective Assignment to Correct the Assignor's Doc Date Previously Recorded on Reel 024773 Frame 0143. Assignor(S) Hereby Confirms the Assignor's Doc Date Is --07/23/2010--. Aug 4, 2010
From: KOTANI, SYOUICHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 024787/0913 →
Assignment of Assignor's Interest Nov 11, 2010
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 025348/0791 →
Assignment of Assignor's Interest Dec 6, 2010
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 025451/0144 →
Corrective Assignment to Correct the Doc Date Previously Recorded on Reel 025451 Frame 0144. Assignor(S) Hereby Confirms the Doc Date Is Incorrect.. Feb 9, 2011
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 025774/0310 →
Assignment of Assignor's Interest Mar 23, 2011
From: JOBETTO, HIROYASU
To: CASIO COMPUTER CO., LTD.
Reel/Frame 026005/0360 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027520/Frame 0401 Jan 13, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027546/0390 →
Merger Nov 18, 2013
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 031664/0873 →
Assignment of Assignor's Interest Nov 4, 2015
From: KANEKO, NORIHIKO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 036962/0116 →
Merger Nov 9, 2015
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 037073/0232 →
Corrective Assignment to Correct the Receiving Party Full City Name and Zip Code Previously Recorded on Reel 037073 Frame 0232. Assignor(S) Hereby Confirms the Merger. Nov 30, 2015
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 037166/0846 →
Merger Dec 11, 2015
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 037269/0120 →
Assignment of Assignor's Interest Jun 24, 2016
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 039007/0986 →
Assignment of Assignor's Interest Nov 18, 2016
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 040371/0554 →
Assignment of Assignor's Interest Jan 27, 2017
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 041521/0001 →
Merger Jan 27, 2017
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 041664/0471 →