IP Library › Assignment 040371/0554
Patent Assignment
Reel/Frame 040371/0554

Assignment of Assignor's Interest

Recorded: 2016-11-18 Pages: 4
Assignor
TERA PROBE, INC.
Executed: 2016-11-11
Assignee
AOI ELECTRONICS CO., LTD.
455-1, KOHZAI-MINAMIMACHI, TAKAMATSU-SHI, KAGAWA, 761-8014, JAPAN
Covered Properties (12)
Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof
Patent: 7,619,306 →
Application: 11/936,179 →
Publication: US 2008/0105981
Semiconductor Device Comprising Electromigration Prevention Film and Manufacturing Method Thereof
Patent: 8,749,065 →
Application: 12/009,719 →
Publication: US 2008/0191357
Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof
Patent: 8,097,941 →
Application: 12/566,423 →
Publication: US 2010/0015795
Semiconductor Device Having Multilayer Wiring Structure and Manufacturing Method of the Same
Patent: 9,252,099 →
Application: 13/235,782 →
Publication: US 2012/0080788
Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same
Patent: 8,871,627 →
Application: 14/081,303 →
Publication: US 2014/0073090
Semiconductor Device Having Projecting Electrode Formed by Electrolytic Plating, and Manufacturing Method Thereof
Application: 14/158,621 →
Semiconductor Device Including Semiconductor Construct Installed on Base Plate, and Manufacturing Method of the Same
Patent: 9,105,580 →
Application: 14/299,775 →
Publication: US 2014/0287555
Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same
Patent: 9,070,638 →
Application: 14/497,944 →
Publication: US 2015/0008579
Semiconductor Device, and Manufacturing Method of Semiconductor Device
Application: 14/597,823 →
Publication: US 2015/0200166
Semiconductor Device Having Low Dielectric Insulating Film and Manufacturing Method of the Same
Patent: 9,640,478 →
Application: 14/750,665 →
Publication: US 2015/0318244
Semiconductor Device Including Semiconductor Construct Installed on Base Plate, and Manufacturing Method of the Same
Patent: 9,343,428 →
Application: 14/791,068 →
Publication: US 2015/0311181
Semiconductor Device and Method of Manufacturing the Same
Patent: 9,607,861 →
Application: 15/016,070 →
Publication: US 2016/0233111
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2007
From: KANEKO, NORIHIKO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020078/0348 →
Assignment of Assignor's Interest Jan 22, 2008
From: KOUNO, ISHIRO; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 020447/0576 →
Assignment of Assignor's Interest Sep 19, 2011
From: ARAI, KAZUYOSHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 026926/0843 →
Assignment of Assignor's Interest Dec 7, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027342/0990 →
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027520/0401 →
Change of Ownership by Corporate Separation Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812 Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027520/Frame 0401 Jan 13, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027546/0390 →
Merger Nov 18, 2013
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 031664/0873 →
Merger Dec 16, 2013
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 031785/0291 →
Assignment of Assignor's Interest Jan 2, 2014
From: MIZUSAWA, AIKO; OKADA, OSAMU; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 031874/0944 →
Certificate of Succession Through Corporate Separation Mar 18, 2014
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 032463/0352 →
Merger Mar 18, 2014
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 032463/0958 →
Assignment of Assignor's Interest Jun 9, 2014
From: WAKISAKA, SHINJI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 033059/0975 →
Merger Jun 9, 2014
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 033107/0574 →
Change of Ownership by Corporate Separation Jun 9, 2014
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 033154/0595 →
Certificate of Succession Through Corporate Separation Sep 26, 2014
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 033830/0464 →
Merger Sep 26, 2014
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 033828/0701 →
Assignment of Assignor's Interest Sep 26, 2014
From: MIZUSAWA, AIKO; OKADA, OSAMU; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 033828/0535 →
Assignment of Assignor's Interest Jan 15, 2015
From: KONO, ICHIRO; NOMURA, KAZUFUMI; FUKUSHIMA, MASATO
To: TERA PROBE, INC.
Reel/Frame 034728/0684 →
Assignment of Assignor's Interest Jun 25, 2015
From: MIZUSAWA, AIKO; OKADA, OSAMU; WAKABAYASHI, TAKESHI; MIHARA, ICHIRO
To: CASIO COMPUTER CO., LTD.
Reel/Frame 035908/0398 →
Certificate of Succession Through Corporate Separation Jun 25, 2015
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 036027/0346 →
Merger Jun 25, 2015
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 036027/0520 →
Assignment of Assignor's Interest Jul 2, 2015
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 036056/0022 →
Merger Jul 2, 2015
From: TERAMIKROS, INC.
To: TERA PROBE, INC.
Reel/Frame 036052/0661 →