IP Library › Assignment 031785/0291
Patent Assignment
Reel/Frame 031785/0291

Merger

Recorded: 2013-12-16 Pages: 31
Assignor
TERAMIKROS, INC.
Executed: 2013-10-01
Assignee
TERA PROBE, INC.
2-7-17, SHIN-YOKOHAMA, KOHOKU-KU,, YOKOHAMA, KANAGAWA, 222--0033, JAPAN
Covered Property (1)
Semiconductor Device Having Multilayer Wiring Structure and Manufacturing Method of the Same
Patent: 9,252,099 →
Application: 13/235,782 →
Publication: US 2012/0080788
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 19, 2011
From: ARAI, KAZUYOSHI
To: CASIO COMPUTER CO., LTD.
Reel/Frame 026926/0843 →
Assignment of Assignor's Interest Dec 7, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027342/0990 →
Assignment of Assignor's Interest Nov 18, 2016
From: TERA PROBE, INC.
To: AOI ELECTRONICS CO., LTD.
Reel/Frame 040371/0554 →