IP Library › Assignment 023625/0161
Patent Assignment
Reel/Frame 023625/0161

Assignment of Assignor's Interest

Recorded: 2009-12-09 Pages: 3
Assignor
SCHULZ, MARTIN, DR.
Executed: 2009-10-05
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Power Semiconductor Module Assembly with Heat Dissipating Element
Patent: 8,324,720 →
Application: 12/563,843 →
Publication: US 2010/0078807