Patent Assignment
Reel/Frame 023635/0487
Assignment of Assignor's Interest
Recorded: 2009-12-10
Pages: 2
Assignor
TAKAIKE, EIJI
Executed: 2009-12-07
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Electronic Component Built-in Substrate and Method of Manufacturing the Same