Electronic component built-in substrate and method of manufacturing the same

1. An electronic component built-in substrate, comprising:

a first wiring substrate having a first wiring substrate main body and a first wiring pattern provided on a first surface of the first wiring substrate main body;

a first electronic component surface-mounted on the first wiring pattern via flip-chip connection with bumps;

a second wiring substrate having a second wiring substrate main body and a second wiring pattern provided on a first surface of the second wiring substrate main body, the second wiring substrate being arranged under the first wiring substrate such that the first surface of the first wiring substrate main body opposes to the first surface of the second wiring substrate main body;

a second electronic component surface-mounted on the second wiring pattern via flip-chip connection with bumps, and arranged to oppose to the first electronic component;

an insulating material made of a glass fiber impregnated with resin, located between the first and the second wiring substrates where the first wiring substrate directly opposes the second wiring substrate;

an underfill material made of a resin which does not include a glass fiber, located between the first and the second electronic components, between the first electronic component and the first wiring substrate, and between the second electronic component and the second wiring substrate; and

an electrode that electrically connects the first wiring substrate with the second wiring substrate, the electrode provided in a portion of the insulating material.

2. The electronic component built-in substrate, according to claim 1 , wherein, when a surface area of a portion of the first electronic component opposing to the second electronic component is larger than a surface area of a portion of the second electronic component opposing to the first electronic component, a plurality of second electronic components are arranged to oppose to the first electronic component.

3. The electronic component built-in substrate, according to claim 1 , wherein, when a surface area of a portion of the second electronic component opposing to the first electronic component is larger than a surface area of a portion of the first electronic component opposing to the second electronic component, a plurality of first electronic components are arranged to oppose to the second electronic component.

4. The electronic component built-in substrate, according to claim 1 , wherein the first wiring substrate has a third wiring pattern, to which a first external connection terminal is connected, on a second surface of the first wiring substrate main body being located on an opposite side to the first surface of the first wiring substrate main body,

the second wiring substrate has a fourth wiring pattern, to which a second external connection terminal is connected, on a second surface of the second wiring substrate main body being located on an opposite side to the first surface of the second wiring substrate main body, and

the base material of the insulating material has a second through portion, from which a part of the first wiring pattern and a part of the second wiring pattern are exposed, in a portion in which the first wiring pattern opposes to the second wiring pattern, and

wherein the electrode further comprises:

a first conductive ball which is contained in the second through portion and is provided on a portion of the first wiring pattern corresponding to an area where the second through portion is formed; and

a second conductive ball which is contained in the second through portion and is provided on a portion of the second wiring pattern corresponding to an area where the second through portion is formed,

wherein the first conductive ball and the second conductive ball are brought into contact mutually.

5. The electronic component built-in substrate, according to claim 4 , further comprising:

a fifth wiring pattern which connects electrically the first wiring pattern and the third wiring pattern, the fifth wiring pattern being provided on the first wiring substrate main body; and

a sixth wiring pattern which connects electrically the second wiring pattern and the fourth wiring pattern, the sixth wiring pattern bring provided on the second wiring substrate main body.