Patent Assignment
Reel/Frame 023655/0562
Assignment of Assignor's Interest
Recorded: 2009-12-15
Pages: 4
Assignor
JUNG, CHUNG-KYUNG
Executed: 2009-09-15
Assignee
DONGBU HITEK CO., LTD.
891-10 DAECHI-DONG, GANGNAM-GU, SEOUL, 135-280, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Fabricating Metal Interconnection of Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.