Patent Assignment
Reel/Frame 023662/0145
Assignment of Assignor's Interest
Recorded: 2009-12-16
Pages: 3
Assignors
LEE, HO-JIN
Executed: 2009-11-24
LEE, DONG-HYUN
Executed: 2009-11-24
LEE, IN-YOUNG
Executed: 2009-11-24
YOON, MIN-SEUNG
Executed: 2009-11-24
HWANG, SON-KWAN
Executed: 2009-11-24
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip, Method of Fabricating the Same, and Stack Module and Memory Card Including the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.