Patent Assignment
Reel/Frame 023671/0508
Assignment of Assignor's Interest
Recorded: 2009-12-08
Pages: 3
Assignor
ISHIDO, KIMINORI
Executed: 2009-12-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Interconnect Substrate, Method of Manufacturing Interconnect Substrate and Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.