Patent Assignment
Reel/Frame 023691/0898
Assignment of Assignor's Interest
Recorded: 2009-12-23
Pages: 4
Assignor
HEWLETT-PACKARED DEVELOPMENT COMPANY, L.P.
Executed: 2008-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Properties
(3)
Multi-Level Integrated Circuit for Wide-Gap Substrate Bonding
Micro-Mirror Device Including Dielectrophoretic Liquid
Microelectromechanical Device with Reset Electrode