IP Library › Assignment 023698/0584
Patent Assignment
Reel/Frame 023698/0584

Assignment of Assignor's Interest

Recorded: 2009-12-23 Pages: 4
Assignor
VORA, MADHUKAR B.
Executed: 2009-12-17
Assignee
MBV ASSOCIATES, INC.
P.O. BOX 321341, LOS GATOS, CALIFORNIA, 95032
Covered Property (1)
Apparatus and methods for high-density chip connectivity
Patent: 8,957,511 →
Application: 11/508,007 →
Publication: US 2007/0194416
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 21, 2010
From: VORA, MADHUKAR B.
To: TERAPEDE, LLC
Reel/Frame 024264/0739 →
Corrective Assignment to Correct the Assignor to Be Changed to Mbv Associates, Inc. Previously Recorded on Reel 024264 Frame 0739. Assignor(S) Hereby Confirms the Previously Recorded Under Reel and Frame 024264/0739 to Correct the Assignor from Madhukar B. Vora to Mbv Associates, Inc.. Apr 26, 2010
From: MBV ASSOCIATES, INC.
To: TERAPEDE, LLC
Reel/Frame 024287/0686 →
Assignment of Assignor's Interest Mar 9, 2012
From: TERAPEDE, LLC
To: TERAPEDE SYSTEMS, INC.
Reel/Frame 027835/0517 →
Security Interest Apr 10, 2018
From: TERAPEDE SYSTEMS, INC.
To: VAREX IMAGING CORPORATION
Reel/Frame 045913/0721 →
Security Interest Oct 30, 2018
From: TERAPEDE SYSTEMS, INC.
To: VAREX IMAGING CORPORATION
Reel/Frame 047363/0285 →