Patent Assignment
Reel/Frame 023710/0042
Assignment of Assignor's Interest
Recorded: 2009-12-15
Pages: 4
Assignor
ANDOU, HIDEKO
Executed: 2009-12-09
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Having Lead Free Solders Between Semiconductor Chip and Frame and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.