Patent Assignment
Reel/Frame 023714/0364
Assignment of Assignor's Interest
Recorded: 2009-12-29
Pages: 2
Assignor
YUAN, TSORNG-DIH
Executed: 2009-12-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Flip Chip Package Having Enhanced Thermal and Mechanical Performance