Patent Assignment
Reel/Frame 023717/0323
Assignment of Assignor's Interest
Recorded: 2009-12-30
Pages: 5
Assignors
LIU, JEN-CHENG
Executed: 2009-11-30
YAUNG, DUN-NIAN
Executed: 2009-11-30
KUO, CHEN-CHENG
Executed: 2009-11-30
CHEN, CHEN-SHIEN
Executed: 2009-11-30
WUU, SHOU-GWO
Executed: 2009-11-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonding Process for Cmos Image Sensor