Patent Assignment
Reel/Frame 023719/0368
Assignment of Assignor's Interest
Recorded: 2009-12-30
Pages: 3
Assignor
CHEN, HSIEN-WEI
Executed: 2009-09-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pad Structure for Semiconductor Devices