Patent Assignment
Reel/Frame 023737/0609
Assignment of Assignor's Interest
Recorded: 2010-01-06
Pages: 4
Assignors
KARIYA, TAKASHI
Executed: 2009-11-17
YOSHIKAWA, KAZUHIRO
Executed: 2009-11-20
KOMATSU, DAIKI
Executed: 2009-11-17
BHANDARI, RAMESH
Executed: 2009-11-13
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Multilayer Printed Wiring Board