IP Library › Assignment 023763/0399
Patent Assignment
Reel/Frame 023763/0399

Assignment of Assignor's Interest

Recorded: 2010-01-12 Pages: 4
Assignors
HUANG, CHUN-MING
Executed: 2009-12-03
WU, CHIEN-MING
Executed: 2009-12-03
YANG, CHIH-CHYAU
Executed: 2009-12-03
CHEN, SHIH-LUN
Executed: 2009-12-03
WEY, CHIN-LONG
Executed: 2009-12-03
CHEN, CHI-SHI
Executed: 2009-12-03
LIN, CHI-SHENG
Executed: 2009-12-03
Assignee
NATIONAL CHIP IMPLEMENTATION CENTER NATIONAL APPLIED RESEARCH LABORATORIES
7F. NO. 26, PROSPERITY RD. 1, SCIENCE PARK, HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Multi-Layer Soc Module Structure
Patent: 8,199,510 →
Application: 12/685,723 →
Publication: US 2011/0096506
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 19, 2016
From: NATIONAL CHIP IMPLEMENTATION CENTER NATIONAL APPLIED RESEARCH LABORATORIES
To: NATIONAL APPLIED RESEARCH LABORATORIES
Reel/Frame 039481/0054 →