IP Library Assignment 023764/0592
Patent Assignment
Reel/Frame 023764/0592

Assignment of Assignor's Interest

Recorded: 2010-01-12 Pages: 10
Assignors
KERDILES, SEBASTIEN
Executed: 2009-07-16
MICHEL, WILLY
Executed: 2009-07-26
SCHWARZCNHACH, WALTER
Executed: 2009-07-07
DELPRAT, DANIEL
Executed: 2009-09-02
MOHAMED, NADIA BEN
Executed: 2009-07-29
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, F-38190 BERNIN, FRANCE
Covered Property (1)
Method of Bonding Two Substrates
Patent: 8,349,703 →
Application: 12/525,493 →
Publication: US 2010/0093152
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 4, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027800/0911 →