Patent Assignment
Reel/Frame 023777/0289
Assignment of Assignor's Interest
Recorded: 2010-01-13
Pages: 8
Assignors
RIES, MICHAEL J.
Executed: 2009-12-07
STANDLEY, ROBERT W.
Executed: 2009-11-30
LIBBERT, JEFFREY L.
Executed: 2009-12-04
JONES, ANDREW M.
Executed: 2009-12-04
WILSON, GREGORY M.
Executed: 2009-12-07
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Method for Processing a Silicon-on-Insulator Structure
Application:
12/623,863 →
Publication:
US 2010/0130021
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →