Patent Assignment
Reel/Frame 023793/0342
Assignment of Assignor's Interest
Recorded: 2010-01-15
Pages: 3
Assignors
KAWAI, SATORU
Executed: 2009-12-25
SAKAI, KENJI
Executed: 2009-12-25
CHEN, LIYI
Executed: 2009-12-22
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board