Printed wiring board and method for manufacturing printed wiring board
A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit.
1. A printed wiring board, comprising:
a resin insulation layer having a first surface and a second surface on an opposite side of the first surface;
a first conductive circuit formed on the second surface of the resin insulation layer;
an electronic-component mounting pad structure comprising an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the first surface of the resin insulation layer; and
a first via conductor formed in the resin insulation layer and connecting the first conductive circuit on the second surface of the resin insulation layer and the embedded portion of the electronic-component mounting pad structure,
wherein the protruding portion of the electronic-component mounting pad structure has a diameter which is larger than a diameter of the embedded portion of the electronic-component mounting pad structure, and the diameter of the embedded portion of the electronic-component mounting pad structure is larger than a surface of the first via conductor in contact with the embedded portion of the electronic-component mounting pad structure.
2. The printed wiring board according to claim 1 , further comprising:
a lower resin insulation layer which is arranged beneath the second surface of the resin insulation layer, and which has a first surface and a second surface on an opposite side of the first surface;
a second conductive circuit formed on the second surface of the lower resin insulation layer; and
a second via conductor formed in the lower resin insulation layer and connecting the first conductive circuit and the second conductive circuit or connecting the first via conductor and the second conductive circuit,
wherein the second conductive circuit or the second via conductor has a portion which is an external connection terminal for connection with an external substrate.
3. The printed wiring board according to claim 1 , further comprising a coating layer made of plating formed on a surface of the protruding portion.
4. The printed wiring board according to claim 3 , wherein the coating layer is made of a tin-plated layer.
5. The printed wiring board according to claim 3 , wherein the coating layer is made of a nickel-plated layer on the electronic-component mounting pad structure and a tin-plated layer on the nickel-plated layer.
6. The printed wiring board according to claim 1 , further comprising a solder bump formed on the electronic-component mounting pad structure.
7. The printed wiring board according to claim 1 , wherein the protruding portion and the embedded portion are directly connected.
8. The printed wiring board according to claim 3 , wherein the coating layer is formed on a top and side surfaces of the protruding portion.
9. The printed wiring board according to claim 1 , wherein the first surface of the resin insulation layer is exposed.
10. The printed wiring board according to claim 1 , wherein the electronic-component mounting pad structure is formed in a pad-forming region, and the first surface of the resin insulation layer except for the pad-forming region is exposed.