Patent Assignment
Reel/Frame 023794/0287
Assignment of Assignor's Interest
Recorded: 2010-01-15
Pages: 4
Assignors
HASEGAWA, YU
Executed: 2010-01-06
KATAGIRI, MITSUAKI
Executed: 2010-01-06
ISA, SATOSHI
Executed: 2010-01-06
IWAKURA, KEN
Executed: 2010-01-06
SASAKI, DAI
Executed: 2010-01-06
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Semiconductor Device Stack with Bonding Layer and Wire Retaining Member
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →