IP Library › Assignment 023823/0606
Patent Assignment
Reel/Frame 023823/0606

Assignment of Assignor's Interest

Recorded: 2010-01-12 Pages: 3
Assignors
NAMBU, HIDETAKA
Executed: 2010-01-05
HIRONAGA, NOBUO
Executed: 2010-01-05
OTA, FUTOSHI
Executed: 2010-01-05
YOKOYAMA, TORU
Executed: 2010-01-05
SUGAWARA, OSAMU
Executed: 2010-01-05
SATOU, RYO
Executed: 2010-01-05
TAMURA, MASATO
Executed: 2010-01-05
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Device Manufacturing Method, Wafer Treatment System, and Recording Medium
Patent: 8,349,087 →
Application: 12/654,987 →
Publication: US 2010/0184296
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 26, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025193/0138 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →