IP Library › Assignment 023826/0978
Patent Assignment
Reel/Frame 023826/0978

Assignment of Assignor's Interest

Recorded: 2010-01-21 Pages: 3
Assignors
HSIAO, CHING-WEN
Executed: 2009-12-31
WU, JIUN YI
Executed: 2010-01-04
HUANG, RU-YING
Executed: 2010-01-05
CHEN, CHEN-SHIEN
Executed: 2010-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Copper Bump Joint Structures with Improved Crack Resistance
Patent: 9,607,936 →
Application: 12/619,468 →
Publication: US 2011/0101526
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →