Assignment of Assignor's Interest

Recorded: 2010-01-21 Pages: 4

Assignors

LEAL, JEFFREY S.

Executed: 2010-01-18

MCGRATH, SCOTT

Executed: 2010-01-11

PANGRLE, SUZETTE K.

Executed: 2010-01-11

Assignee

VERTICAL CIRCUITS, INC.

10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066

Covered Properties (3)

Semiconductor Die Interconnect Formed by Aerosol Application of Electrically Conductive Material

Application: 12/634,598 →

Publication: US 2010/0140811

Semiconductor Die Interconnect Formed by Aerosol Application of Electrically Conductive Material

Application: 61/121,138 →

Stacked die assembly having reduced stress electrical interconnects

Application: 61/280,584 →

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.