Patent Assignment
Reel/Frame 029186/0755
Assignment of Assignor's Interest
Recorded: 2012-10-24
Pages: 6
Assignor
VERTICAL CIRCUITS, INC.
Executed: 2012-10-23
Assignee
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, BUILDING A, MOUNTAIN VIEW, CALIFORNIA, 94043
Covered Properties
(50)
Vertical Interconnect Process for Silicon Segments
Patent:
5,675,180 →
Application:
08/265,081 →
A Conductive Expoxy Flip-Chip Package and Method
Patent:
5,657,206 →
Application:
08/374,421 →
Silicon Segment Programming Method and Apparatus
Patent:
5,698,895 →
Application:
08/376,149 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,661,087 →
Application:
08/476,623 →
Conductive Epoxy Flip-Chip Package and Method
Patent:
6,134,118 →
Application:
08/834,798 →
Vertical Interconnect Process for Silicon Segments
Patent:
6,188,126 →
Application:
08/842,448 →
Silicon Segment Programming Method
Patent:
5,994,170 →
Application:
08/845,654 →
Speaker Diaphragm
Patent:
5,936,302 →
Application:
08/845,655 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,837,566 →
Application:
08/847,309 →
Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,255,726 →
Application:
08/915,620 →
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent:
6,098,278 →
Application:
08/917,447 →
Conductive Epoxy Flip-Chip on Chip
Patent:
6,271,598 →
Application:
08/918,500 →
Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,124,633 →
Application:
08/918,501 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
5,891,761 →
Application:
08/918,502 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,080,596 →
Application:
08/920,273 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,177,296 →
Application:
09/273,941 →
Silicon Segment Programming Apparatus and Three Terminal Fuse Configuration
Patent:
6,486,528 →
Application:
09/378,879 →
Three Dimensional Six Surface Conformal Die Coating
Stacked Die Bga or Lga Component Assembly
Micropede Stacked Die Component Assembly
Assembly Having Stacked Die Mounted on Substrate
Die Assembly Having Electrical Interconnect
Three Dimensional Six Surface Conformal Die Coating
Application:
11/849,162 →
Publication:
US 2007/0290377
Vertical Electrical Interconnect Formed on Support Prior to Die Mount
Electrically Interconnected Stacked Die Assemblies
Electrical Interconnect Formed by Pulsed Dispense
Application:
12/124,097 →
Publication:
US 2009/0068790
Wafer Level Surface Passivation of Stackable Integrated Circuit Chips
Three-Dimensional Circuitry Formed on Integrated Circuit Device Using Two-Dimensional Fabrication
Application:
12/143,157 →
Publication:
US 2008/0315407
Semiconductor Die Mount by Conformal Die Coating
Flat Leadless Packages and Stacked Leadless Package Assemblies
Chip Scale Stacked Die Package
Application:
12/251,624 →
Publication:
US 2009/0102038
Semiconductor Die Separation Method
Rotating Union
Support Mounted Electrically Interconnected Die Assembly
Folding Rechargeable Worklight
Image Sensor
Application:
12/550,012 →
Publication:
US 2010/0052087
Semiconductor Die Interconnect Formed by Aerosol Application of Electrically Conductive Material
Application:
12/634,598 →
Publication:
US 2010/0140811
Flip-chip underfill
Application:
12/776,262 →
Publication:
US 2011/0115099
Electrical Interconnect for Die Stacked in Zig-Zag Configuration
Flat Leadless Packages and Stacked Leadless Package Assemblies
Selective Die Electrical Insulation By Additive Process
Electrically Interconnected Stacked Die Assemblies
Stacked Die Assembly Having Reduced Stress Electrical Interconnects
Semiconductor Die Array Structure
Wafer Level Surface Passivation of Stackable Integrated Circuit Chips
Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies
Semiconductor Die Having Fine Pitch Electrical Interconnects
Support Mounted Electrically Interconnected Die Assembly
Emi Shield
Application:
61/556,075 →
Bonding Wedge
Application:
61/556,141 →
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0970 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0991 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029627/0001 →
Assignment of Assignor's Interest
Jan 15, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029645/0465 →
Assignment of Assignor's Interest
Jan 16, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029646/0558 →
Change of Name
Jan 22, 2013
From: CUBIC MEMORY, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029674/0462 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →