IP Library › Granted Patent US 6,255,726
Granted Patent Utility
US 6,255,726 · App. 08/915,620

Vertical interconnect process for silicon segments with dielectric isolation

Inventors: Alfons Vindasius, Kenneth M. Sautter
Patented Case View Patent ↗
Granted: Jul 3, 2001 Filed: Aug 21, 1997
Inventors
Alfons Vindasius
Kenneth M. Sautter
Assignee (at issue)
Cubic Memory, Inc.

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Quick Facts
Patent No.
US 6,255,726
App. No.
08/915,620
Filed
1997-08-21
Granted
2001-07-03
Kind
A