Patent Assignment
Reel/Frame 029736/0944
Assignment of Assignor's Interest
Recorded: 2013-01-30
Pages: 10
Assignor
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Executed: 2012-11-09
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(28)
Vertical Interconnect Process for Silicon Segments
Patent:
5,675,180 →
Application:
08/265,081 →
A Conductive Expoxy Flip-Chip Package and Method
Patent:
5,657,206 →
Application:
08/374,421 →
Silicon Segment Programming Method and Apparatus
Patent:
5,698,895 →
Application:
08/376,149 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,661,087 →
Application:
08/476,623 →
Conductive Epoxy Flip-Chip Package and Method
Patent:
6,134,118 →
Application:
08/834,798 →
Vertical Interconnect Process for Silicon Segments
Patent:
6,188,126 →
Application:
08/842,448 →
Silicon Segment Programming Method
Patent:
5,994,170 →
Application:
08/845,654 →
Speaker Diaphragm
Patent:
5,936,302 →
Application:
08/845,655 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,837,566 →
Application:
08/847,309 →
Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,255,726 →
Application:
08/915,620 →
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent:
6,098,278 →
Application:
08/917,447 →
Conductive Epoxy Flip-Chip on Chip
Patent:
6,271,598 →
Application:
08/918,500 →
Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,124,633 →
Application:
08/918,501 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
5,891,761 →
Application:
08/918,502 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,080,596 →
Application:
08/920,273 →
Silicon Segment Programming Apparatus and Three Terminal Fuse Configuration
Patent:
6,486,528 →
Application:
09/378,879 →
Three Dimensional Six Surface Conformal Die Coating
Stacked Die Bga or Lga Component Assembly
Micropede Stacked Die Component Assembly
Assembly Having Stacked Die Mounted on Substrate
Die Assembly Having Electrical Interconnect
Vertical Electrical Interconnect Formed on Support Prior to Die Mount
Electrically Interconnected Stacked Die Assemblies
Wafer Level Surface Passivation of Stackable Integrated Circuit Chips
Electrically Interconnected Stacked Die Assemblies
Wafer Level Surface Passivation of Stackable Integrated Circuit Chips
Emi Shield
Application:
61/556,075 →
Bonding Wedge
Application:
61/556,141 →
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Jan 10, 2013
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; JACOBSEN, LARRY; ALMEN, DONALD
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029627/0150 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0991 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029627/0001 →
Assignment of Assignor's Interest
Jan 10, 2013
From: VINDASIUS, ALFONS; ROBINSON, MARC E.; JACOBSEN, LARRY; ALMEN, DONALD
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029627/0102 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0970 →
Assignment of Assignor's Interest
Jan 15, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029645/0465 →
Assignment of Assignor's Interest
Jan 16, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029646/0558 →
Change of Name
Jan 22, 2013
From: CUBIC MEMORY, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029674/0462 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →