Patent Assignment
Reel/Frame 029674/0462
Change of Name
Recorded: 2013-01-22
Pages: 8
Assignor
CUBIC MEMORY, INC.
Executed: 1999-10-21
Assignee
VERTICAL CIRCUITS, INC.
222 DELAWARE AVENUE, WILMINGTON, DELAWARE, 19899
Covered Properties
(15)
Vertical Interconnect Process for Silicon Segments
Patent:
5,675,180 →
Application:
08/265,081 →
A Conductive Expoxy Flip-Chip Package and Method
Patent:
5,657,206 →
Application:
08/374,421 →
Silicon Segment Programming Method and Apparatus
Patent:
5,698,895 →
Application:
08/376,149 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,661,087 →
Application:
08/476,623 →
Conductive Epoxy Flip-Chip Package and Method
Patent:
6,134,118 →
Application:
08/834,798 →
Vertical Interconnect Process for Silicon Segments
Patent:
6,188,126 →
Application:
08/842,448 →
Silicon Segment Programming Method
Patent:
5,994,170 →
Application:
08/845,654 →
Speaker Diaphragm
Patent:
5,936,302 →
Application:
08/845,655 →
Vertical Interconnect Process for Silicon Segments
Patent:
5,837,566 →
Application:
08/847,309 →
Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,255,726 →
Application:
08/915,620 →
Method for Forming Conductive Epoxy Flip-Chip on Chip
Patent:
6,098,278 →
Application:
08/917,447 →
Conductive Epoxy Flip-Chip on Chip
Patent:
6,271,598 →
Application:
08/918,500 →
Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
6,124,633 →
Application:
08/918,501 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Thermally Conductive Epoxy Preform
Patent:
5,891,761 →
Application:
08/918,502 →
Method for Forming Vertical Interconnect Process for Silicon Segments with Dielectric Isolation
Patent:
6,080,596 →
Application:
08/920,273 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0970 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029626/0991 →
Assignment of Assignor's Interest
Jan 10, 2013
From: PEDERSEN, DAVID V.; FINLEY, MICHAEL G.; SAUTTER, KENNETH M.
To: CUBIC MEMORY, INC.
Reel/Frame 029627/0001 →
Assignment of Assignor's Interest
Jan 23, 2013
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS SOLUTIONS, INC.
Reel/Frame 029683/0797 →
Change of Name
Jan 24, 2013
From: VERTICAL CIRCUITS SOLUTIONS, INC.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 029686/0255 →
Assignment of Assignor's Interest
Jan 30, 2013
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029736/0944 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →