Granted Patent
Utility
US 6,134,118 · App. 08/834,798
Conductive epoxy flip-chip package and method
Inventors:
David V. Pedersen, Michael G. Finley, Kenneth M. Sautter
Patented Case
View Patent ↗
Granted: Oct 17, 2000
Filed: Apr 3, 1997
Inventors
David V. Pedersen
Michael G. Finley
Kenneth M. Sautter
Assignee (at issue)
Cubic Memory, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.