Support mounted electrically interconnected die assembly

1. A device comprising a support having electrical connection sites at a surface thereof, and a stacked die assembly mounted over the surface and electrically connected to one or more of the connection sites, the stacked die assembly comprising at least two nonpackaged die mounted one over another, wherein each die in the stacked die assembly has peripheral interconnect terminals, and the die in the stack are electrically interconnected by lines or traces of an electrically conductive material, which may be an electrically conductive polymer, or an electrically conductive ink, that contacts interconnect terminals on the respective die.

2. The device of claim 1 wherein the lines or traces of electrically conductive material that interconnect the die in the stack also connect to the connection sites on the support.

3. The device of claim 1 wherein an additional quantity of an electrically conductive material makes contact between the lines or traces of electrically conductive material that interconnect the die in the stack and the connection sites on the support.

4. The device of claim 3 wherein the additional quantity of an electrically conductive material comprises the same material as the material of the die stack interconnects.

5. The device of claim 3 wherein the additional quantity of an electrically conductive material comprises a material different from the material of the die stack interconnects.

6. The device of claim 1 wherein the support comprises a natural dielectric material.

7. The device of claim 1 wherein the support comprises a synthetic dielectric material.

8. The device of claim 1 wherein the support comprises an organic dielectric material.

9. The device of claim 1 wherein the support comprises an inorganic dielectric material.

10. The device of claim 1 wherein the support comprises a package substrate.

11. The device of claim 1 wherein the support comprises a lead frame.

12. The device of claim 1 wherein the support comprises a printed circuit board.

13. A device comprising a first support having electrical connection sites at a surface thereof, an additional support mounted on the first support, and a stacked die assembly mounted onto a surface of the additional support and electrically connected to one or more of the connection sites on the first support, the stacked die assembly comprising at least two nonpackaged die mounted one over another, wherein each die in the stacked die assembly has peripheral interconnect terminals, and the die in the stack are electrically interconnected by lines or traces of an electrically conductive material, which may be an electrically conductive polymer, or an electrically conductive ink, that contacts interconnect terminals on the respective die.

14. The device of claim 13 wherein the additional support is electrically connected to the first support.

15. The device of claim 14 wherein a plurality of the electrical connections of the die in the stacked die units or assemblies bypass the additional support.

16. The device of claim 15 wherein there is no direct electrical connection between the die assembly and interconnect pads or sites on the additional support.

17. The device of claim 13 wherein the additional support comprises no electrical or electronic components.

18. The device of claim 13 wherein the additional support comprises a dummy die.

19. The device of claim 13 wherein the additional support comprises a sheet of dielectric material.

20. The device of claim 13 wherein the additional support comprises a heat dissipating sheet.

21. The device of claim 13 wherein the additional support comprises a material having a high heat capacity or high thermal conductivity.

22. The device of claim 13 wherein the additional support comprises only passive electrical features.

23. The device of claim 14 wherein the additional support comprises passive features that are electrically connected to one or more sites in the first support.

24. The device of claim 14 wherein the additional support comprises passive features that are electrically connected to a selected number, less than all, of the interconnections in the die assembly.

25. The device of claim 14 wherein the additional support comprises passive features that are electrically connected to a selected number, less than all, of the interconnections in the die assembly and to one or more sites in the support.

26. The device of claim 14 wherein the additional support comprises a ground plane.

27. The device of claim 13 wherein the additional support comprises electronic circuitry.

28. The device of claim 27 wherein the additional support comprises a semiconductor device.

29. The device of claim 27 wherein the additional support comprises a semiconductor package.

30. The device of claim 27 wherein the additional support comprises an additional die.

31. The device of claim 27 wherein at least one connection site in the additional support is electrically connected to a site in the first support.

32. The device of claim 27 wherein at least one connection site in the additional support is electrically connected to at least one, less than all, of the interconnections in the die assembly.

33. The device of claim 27 wherein at least one connection site in the additional support is electrically connected to at least one, less than all, of the interconnections in the die unit or assembly and wherein at least one connection site in the additional support is electrically connected to one or more sites in the first support.

34. The device of claim 13 wherein the additional support includes electronic circuitry, and wherein the electronic circuitry in the second support and the die assembly or unit are separately connected to the first support.

35. The device of claim 34 wherein the additional support comprises a supporting die, and pads on the supporting die are connected to a second set of bond sites on the first support, and interconnects in the die assembly or unit are connected to a first set of bond sites on the first support.

36. The device of claim 34 wherein the additional support comprises a supporting semiconductor package, and lands on the supporting package are connected to a second set of bond pads on the first support, and interconnects in the die assembly are connected to a first set of bond sites on the first support.

37. A method for making a device, comprising: providing a stacked die assembly comprising at least two nonpackaged die mounted one over another, wherein each die in the stacked die assembly has peripheral interconnect terminals, and the die in the stack are electrically interconnected by lines or traces of an electrically conductive material that contacts interconnect terminals on the respective die; providing a support having electrical connection sites at a surface thereof; and mounting the die assembly over the surface and electrically connecting one or more interconnect terminals in the die assembly to one or more of the connection sites on the support.

38. A method for making a device, comprising: providing a stacked die assembly comprising at least two nonpackaged die mounted one over another wherein each die in the stacked die assembly has peripheral interconnect terminals, and the die in the stack are electrically interconnected by lines or traces of an electrically conductive material that contacts interconnect terminals on the respective die; providing a first support having electrical connection sites at a surface thereof; providing a second support having a mount surface; mounting the die assembly on the mount surface of the second support and electrically connecting one or more interconnect terminals in the die assembly to one or more of the connection sites on the first support.