Patent Assignment
Reel/Frame 029458/0905
Assignment of Assignor's Interest
Recorded: 2012-12-06
Pages: 10
Assignor
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Executed: 2012-11-09
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(12)
Semiconductor Die Mount by Conformal Die Coating
Flat Leadless Packages and Stacked Leadless Package Assemblies
Semiconductor Die Separation Method
Support Mounted Electrically Interconnected Die Assembly
Electrical Interconnect for Die Stacked in Zig-Zag Configuration
Flat Leadless Packages and Stacked Leadless Package Assemblies
Selective Die Electrical Insulation By Additive Process
Stacked Die Assembly Having Reduced Stress Electrical Interconnects
Semiconductor Die Array Structure
Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies
Semiconductor Die Having Fine Pitch Electrical Interconnects
Support Mounted Electrically Interconnected Die Assembly
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Jan 7, 2015
From: MCELREA, SIMON J. S.; ROBINSON, MARC E.; ANDREWS, JR., LAWRENCE DOUGLAS
To: VERTICAL CIRCUITS, INC.
Reel/Frame 034654/0626 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →