Flat leadless packages and stacked leadless package assemblies
View Patent ↗A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
1. A flat leadless package comprising a leadframe comprising a plurality of leads and a plurality of die in a stack mounted onto the leadframe and electrically connected to at least some of said leads by an interconnect material comprising an electrically conductive polymer or an electrically conductive ink.
2. The package of claim 1 wherein at least one said die is mounted die-down.
3. The package of claim 1 wherein at least one said die is mounted die-up.
4. The package of claim 1 wherein at least one die in the stack is oriented die-up and at least one die in the stack is oriented die-down.
5. The package of claim 1 wherein the die in the stack all have the same dimensions.
6. The package of claim 1 wherein at least one die in the stack is dimensioned differently from at least one other die in the stack.
7. The package of claim 1 wherein die pads are arranged in at least one row in a margin along or adjacent at least one interconnect edge.
8. The package of claim 7 wherein an interconnect edge of a first die in the stack overlies an interconnect edge in a second die in the stack.
9. The package of claim 7 wherein an interconnect edge of a first die in a stack is offset in relation to an interconnect edge of a second die in the stack.
10. The package of claim 1 wherein the interconnect material comprises an electrically conductive polymer.
11. The package of claim 1 wherein the interconnect material comprises a polymer filled with conductive material in particle form.
12. The package of claim 1 wherein the interconnect material comprises a material selected from: a metal filled epoxy, a metal filled thermosetting polymer, a metal filled thermoplastic polymer, an electrically conductive ink.
13. The package of claim 1 wherein the interconnect material comprises a curable material.
14. The package of claim 1 wherein the interconnect material comprises a sintered electrically conductive ink.
15. The package of claim 1 wherein the interconnect material comprises a metallization plated onto a printed electroless plating catalyst.
16. An assembly of stacked flat leadless packages having lead ends exposed at least one sidewall thereof, wherein the packages are interconnected using an electrically conductive polymer or an electrically conductive ink.
17. The assembly of claim 16 wherein at least one said package is a flat leadless package containing at least one wire bonded die.
18. The assembly of claim 16 wherein at least one said package is a flat leadless package containing at least one flip-chip die.
19. The assembly of claim 16 wherein at least one said package is a flat leadless package having at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink.
20. The assembly of claim 16 wherein the end surfaces of the leads are generally flush with at least a portion of the sidewall.
21. The assembly of claim 16 wherein the end surfaces of the leads are recessed with respect to a plane of at least a portion of the sidewall.
22. The assembly of claim 16 wherein at least one said package includes one or more stacks of die.
23. The assembly of claim 16 wherein the packages in a stack are all the same type of package.
24. The assembly of claim 16 wherein at least one said package is a type different from at least one other package.
25. The assembly of claim 16 wherein the packages in a stack have the same dimensions.
26. The assembly of claim 16 wherein at least one package in a stack is dimensioned differently from at least one other package in a stack.
27. A package module comprising a flat leadless package having lead ends exposed at least one sidewall thereof, electrically connected to circuitry in an underlying support using an electrically conductive polymer or an electrically conductive ink.
28. A package module, comprising a plurality of stacked flat leadless packages having lead ends exposed at least one sidewall thereof, interconnected using an electrically conductive polymer or an electrically conductive ink.
29. The package module of claim 27 wherein the underlying support comprises a printed circuit board.
30. The package module of claim 27 wherein the underlying support comprises a module leadframe.
31. The package module of claim 28 wherein the packages in a stack have the same dimensions.
32. The package module of claim 28 wherein at least one package in a stack is dimensioned differently from at least one other package in a stack.
33. The package module of claim 27 wherein the underlying support comprises a printed circuit board.
34. The package module of claim 27 wherein the underlying support comprises a module leadframe.