Patent Assignment
Reel/Frame 023837/0519
Assignment of Assignor's Interest
Recorded: 2010-01-25
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Package on Package Having a Conductive Post with Height Lower Than an Uypper Surface of an Encapsulation Layer to Prevent Circuit Pattern Lift Defect and Method of Fabricating the Same