Patent Assignment
Reel/Frame 023842/0147
Assignment of Assignor's Interest
Recorded: 2010-01-22
Pages: 3
Assignor
JOHNSON, MORGAN T.
Executed: 2010-01-18
Assignee
ADVANCED INQUIRY SYSTEMS, INC.
20520 NW EVERGREEN PARKWAY, SUITE 100, HILLSBORO, OREGON, 97124
Covered Property
(1)
Methods of Adding Pads and One or More Interconnect Layers to the Passivated Topside of a Wafer Including Connections to at Least a Portion of the Integrated Circuit Pads Thereon
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.