Patent Assignment
Reel/Frame 023864/0729
Assignment of Assignor's Interest
Recorded: 2010-01-28
Pages: 2
Assignors
TAKASAWA, YUSHIN
Executed: 2010-01-13
KARASAWA, HAJIME
Executed: 2010-01-13
HIROSE, YOSHIRO
Executed: 2010-01-13
Assignee
HITACHI KOKUSAI ELECTRIC, INC.
14-1 SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate and Substrate Processing Apparatus for Forming Thin Film Containing at Least Two Different Elements
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.