IP Library Assignment 047082/0912
Patent Assignment
Reel/Frame 047082/0912

Assignment of Assignor's Interest

Recorded: 2018-10-05 Pages: 4
Assignor
HITACHI KOKUSAI ELECTRIC INC.
Executed: 2018-10-04
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Properties (10)
Apparatus and Method for Use in Manufacturing a Semiconductor Device
Patent: 6,576,063 →
Application: 09/768,663 →
Publication: US 2001/0029112
Method for Use in Manufacturing a Semiconductor Device
Patent: 6,514,869 →
Application: 09/924,538 →
Publication: US 2002/0034862
Substrate Processing Apparatus and Method for Manufacturing Semiconductor Device
Patent: 6,744,018 →
Application: 10/259,762 →
Publication: US 2003/0183613
Apparatus and Method for Use in Manufacturing a Semiconductor Device
Patent: 7,033,937 →
Application: 10/342,011 →
Publication: US 2003/0124876
Substrate Processing Apparatus and Semiconductor Device Producing Method
Patent: 7,622,007 →
Application: 10/549,933 →
Publication: US 2007/0034158
Substrate Processing Apparatus
Patent: 7,808,396 →
Application: 11/991,093 →
Publication: US 2009/0072990
Substrate Processing Apparatus and Semiconductor Device Producing Method
Patent: 8,673,076 →
Application: 12/578,012 →
Publication: US 2010/0081288
Method of Manufacturing Semiconductor Device, Method of Processing Substrate and Substrate Processing Apparatus for Forming Thin Film Containing at Least Two Different Elements
Patent: 9,318,316 →
Application: 12/625,712 →
Publication: US 2010/0130024
Dual Loading Port Semiconductor Processing Equipment
Patent: 43,023 →
Application: 12/724,026 →
Method of Manufacturing Semiconductor Device and Substrate Processing Apparatus
Patent: 8,409,988 →
Application: 13/115,578 →
Publication: US 2011/0294280
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 24, 2001
From: TOYODA, KAZUYUKI; KASAHARA, OSAMU; TANAKA, TSUTOMU; SUEYOSHI, MAMORU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 011502/0717 →
Assignment of Assignor's Interest Aug 9, 2001
From: WADA, TETSUYA; MIYATA, TOSHIMITSU; NISHITANI, EISUKE
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 012063/0663 →
Assignment of Assignor's Interest Jan 3, 2003
From: TAKANO, SATOSHI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 013330/0990 →
Assignment of Assignor's Interest Sep 11, 2006
From: NAKAISO, NAOHARU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 018229/0396 →
Assignment of Assignor's Interest Apr 23, 2008
From: IIDA, TSUKASA; YONEDA, AKIHIKO; INOSHIMA, KAORI
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 020851/0071 →
Assignment of Assignor's Interest Jan 28, 2010
From: TAKASAWA, YUSHIN; KARASAWA, HAJIME; HIROSE, YOSHIRO
To: HITACHI KOKUSAI ELECTRIC, INC.
Reel/Frame 023864/0729 →
Assignment of Assignor's Interest Jul 29, 2011
From: TAKASAWA, YUSHIN; KARASAWA, HAJIME; HIROSE, YOSHIRO
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 026674/0080 →