Patent Assignment
Reel/Frame 023868/0106
Assignment of Assignor's Interest
Recorded: 2010-01-28
Pages: 3
Assignors
PARK, CHUL
Executed: 2010-01-20
KIM, HYEONG-SEOB
Executed: 2010-01-20
YEOM, KUN-DAE
Executed: 2010-01-20
LIM, GWANG-MAN
Executed: 2010-01-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SOUTH, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Multiple Chips and Separate Groups of Leads