Patent Assignment
Reel/Frame 023946/0357
Change of Name
Recorded: 2010-02-17
Pages: 3
Assignor
ALPHASEM GMBH
Executed: 2009-12-15
Assignee
KULICKE & SOFFA DIE BONDING GMBH
ANDHAUSERSTRASSE 52, BERG, 8572, SWITZERLAND
Covered Property
(1)
Method and Apparatus for the Placement of Electronic Components, in Particular Semi Conductor Chips on a Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.