Patent Assignment
Reel/Frame 023947/0606
Assignment of Assignor's Interest
Recorded: 2010-01-26
Pages: 3
Assignors
KIM, PYOUNG-WAN
Executed: 2010-01-12
YOON, MIN-SEUNG
Executed: 2010-01-12
KIM, NAM-SEOG
Executed: 2010-01-12
MA, KEUM-HEE
Executed: 2010-01-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Stack Package and Method of Fabricating the Same