Patent Assignment
Reel/Frame 023969/0604
Assignment of Assignor's Interest
Recorded: 2010-02-03
Pages: 3
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.