Patent Assignment
Reel/Frame 023985/0775
Assignment of Assignor's Interest
Recorded: 2010-02-25
Received: 2010-02-25
Pages: 5
Assignor
HITACHI, LTD.
Executed: 2010-02-05
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JPX, JAPAN
Covered Properties
(9)
Method for preventing mold formation by using hydrophobic materials, and mold-controlling agent for building parts
Application:
10/551,841 →
Information and status and statistics messaging method and system for inter-process communication
Application:
11/588,878 →
Electrowetting Dispensing Devices and Related Methods
Application:
11/213,355 →
Transparent Molding Composition for Optical Applications
Application:
10/784,712 →
Semiconductor Device
Application:
10/231,286 →
Semiconductor Integrated Circuit Device Having an Optimal Circuit Layout to Ensure Stabilization of Internal Source Voltages Without Lowering Circuit Functions and/or Operating Performance
Application:
10/142,897 →
Reference Voltage Generator Permitting Stable Operation
Application:
10/012,522 →
Semiconductor Device
Application:
09/964,669 →
Semiconductor Memory Device and Memory System
Application:
09/939,677 →