Patent Assignment
Reel/Frame 024000/0806
Assignment of Assignor's Interest
Recorded: 2010-02-26
Pages: 3
Assignors
LEE, EUNG SUEK
Executed: 2009-12-22
MOK, JEE SOO
Executed: 2009-12-22
HWANG, JUN OH
Executed: 2009-12-22
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Die Mounting Substrate and Method of Fabricating the Same