Patent Assignment
Reel/Frame 024003/0337
Assignment of Assignor's Interest
Recorded: 2010-02-26
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device, Semiconductor Package and System Having Stack-Structured Semiconductor Chips