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Patent Assignment
Reel/Frame 024003/0665

Assignment of Assignor's Interest

Recorded: 2010-03-01 Pages: 6
Assignors
MATSUDA, TSUKASA
Executed: 2010-02-12
CHOI, GILHEYUN
Executed: 2010-02-12
LEE, JONGMYEONG
Executed: 2010-02-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 000, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
Patent: 8,148,261 →
Application: 12/714,571 →
Publication: US 2010/0227473